JPH0369230U - - Google Patents
Info
- Publication number
- JPH0369230U JPH0369230U JP1989131168U JP13116889U JPH0369230U JP H0369230 U JPH0369230 U JP H0369230U JP 1989131168 U JP1989131168 U JP 1989131168U JP 13116889 U JP13116889 U JP 13116889U JP H0369230 U JPH0369230 U JP H0369230U
- Authority
- JP
- Japan
- Prior art keywords
- group
- semiconductor
- semiconductor substrate
- solder bump
- connection areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims 5
- 239000002184 metal Substances 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989131168U JPH0369230U (en]) | 1989-11-10 | 1989-11-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989131168U JPH0369230U (en]) | 1989-11-10 | 1989-11-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0369230U true JPH0369230U (en]) | 1991-07-09 |
Family
ID=31678691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989131168U Pending JPH0369230U (en]) | 1989-11-10 | 1989-11-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0369230U (en]) |
-
1989
- 1989-11-10 JP JP1989131168U patent/JPH0369230U/ja active Pending
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